As demand for data continues to surge, the challenge is no longer just speed but how to deliver it sustainably. At today’s QAMSS lecture, Prof. Martijn Heck of Eindhoven University of Technology outlined how the next generation of photonic technologies could meet both goals.
Heck presented a clear assessment of why existing photonic integrated circuit (PIC) platforms fall short when used in isolation. Indium phosphide (InP) systems excel in lasers and high-speed components but face limits in scalability and manufacturing. Silicon photonics, while supported by mature complementary metal-oxide-semiconductor (CMOS) fabrication, still lacks efficient on-chip light sources and high-performance modulators.
The proposed path forward is heterogeneous integration, combining different photonic materials and tightly integrating them with electronics. This approach allows engineers to harness the strengths of each platform while overcoming their individual weaknesses. Close coupling with electronic circuits is also critical to reduce parasitic effects and improve efficiency.
Heck highlighted several enabling technologies. Die-bonding allows InP-based active devices to be integrated onto silicon photonic circuits, while wafer-bonding techniques can produce thin InP membranes on silicon substrates. Micro-transfer printing was presented as a particularly flexible method, enabling precise placement of components across silicon and silicon nitride systems.
Together, these advances point toward wafer-scale integration as a realistic solution for the field. The talk emphasised a shift in strategy: future progress will depend less on competing materials and more on how effectively they can be combined to deliver faster, more energy-efficient data systems.